发明名称 Laser machining apparatus with switchable laser system and laser machining method
摘要 A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.
申请公布号 US8916798(B2) 申请公布日期 2014.12.23
申请号 US201213372546 申请日期 2012.02.14
申请人 Ewag AG 发明人 Plüss Christoph
分类号 B23K26/36;B23K26/42;B23K26/06;B23P25/00;B23K26/30;B23K26/38;B23K26/08 主分类号 B23K26/36
代理机构 代理人 Lombard R. S.;Bach K.
主权项 1. Laser machining apparatus (10) comprising a holder (12) for holding a workpiece (11), a laser arrangement (16) for switching between a first operating mode (I) and a second operating mode (II), said laser arrangement comprising a first laser head (14) for use in the first operating mode (I) and a second laser head (15) for use in the second operating mode (II), the laser arrangement (16) for machining the workpiece (11) by thermal action in the first operating mode (I) wherein a thermally influenced zone (W) is produced on the workpiece (11) and for machining the workpiece (11) by laser ablation in the second operating mode (II) wherein at least partly or entirely the thermally influenced zone (W) on the workpiece (11) produced during the first operating mode (I) is removed, and the laser arrangement (16) comprising several infeed axes (13) for moving and/or positioning the holder (12) relative to the first and the second laser heads (14, 15).
地址 Etziken CH