发明名称 COOLING STRUCTURE OF BOARD MODULE
摘要 <p>PROBLEM TO BE SOLVED: To provide a cooling structure of a board module which allows for efficient cooling of a board module housed in a housing with a simple configuration.SOLUTION: A cooling structure of a board module includes a rail 109 formed for each slot slidably in a direction for housing a board module 102 while holding the ends on both sides thereof, a housing 101 having a suction hole 107 formed for each slot along the rail 109, and a shutter 110 having a lever 111 formed to come into contact with the board module 102, and installed to open and close the suction hole 107 by sliding while interlocking with sliding of the board module 102. When housing the board module 102 in the slot, the suction hole 107 opens as the board module 102 abuts against a lever 111 and the shutter 110 slides, thus forming an air flow from the suction hole 107 above the board module 102.</p>
申请公布号 JP2014225612(A) 申请公布日期 2014.12.04
申请号 JP20130105054 申请日期 2013.05.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJINUMA TSUNEO
分类号 H05K7/20 主分类号 H05K7/20
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