发明名称 HIGHLY THERMALLY CONDUCTIVE MIXTURE AND HIGHLY THERMALLY CONDUCTIVE MOLDED BODY
摘要 <p>PROBLEM TO BE SOLVED: To provide a highly thermally conductive mixture which exhibits fire retardancy, high thermal conductivity, and an electrical insulation property, further, which can be molded into a thin-wall shape, and which is excellent in re-sticking workability even when an adhesive layer is provided thereon, and to provide a highly thermally conductive molded body using the highly thermally conductive mixture.SOLUTION: A highly thermally conductive mixture which contains: 100 pts.mass ofα-olefin copolymer rubber including ethylene-propylene rubber and ethylene-α-olefin rubber (however, propylene is excluded fromα-olefin), in which a mass ratio of the ethylene-propylene rubber to the ethylene-α-olefin rubber is 10:90 to 70:30; and 300-700 pts.mass of a thermally conductive filler, and a highly thermally conductive molded body formed by molding the highly thermally conductive mixture, are disclosed.</p>
申请公布号 JP2014224200(A) 申请公布日期 2014.12.04
申请号 JP20130104417 申请日期 2013.05.16
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 MIYAHARA TOSHIO;MOCHIHARA KAZUKI
分类号 C08L23/08;C08K3/22;C08K3/28;C08K3/38;C08L23/16 主分类号 C08L23/08
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