| 摘要 |
An exemplary method for manufacturing a thermally insulating electronic device casing includes the following steps. First, a cover and a mold are provided. The cover includes a top surface. The mold includes a bottom surface, and the bottom surface of the mold is depressed inwardly thereby defining a recess. Next, the mold is arranged to cover the cover, with the bottom surface of the mold attached on the top surface of the cover. Thereby, a room is cooperatively defined by the recess and the top surface of the cover. Then the room is filled with aerogel solution. After that, the aerogel solution in the room is dried. Finally, the mold is and removed from the cover. |
