| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramics circuit board having a brazing-filler-metal-extruding part less in defect owing to a cavity or the like, and improved in heat resistance cycle.SOLUTION: A ceramics circuit board according to one embodiment comprises: a ceramics base (1); a copper circuit board (5); and a brazing-filler-metal-extruding part (4a). The copper circuit board (5) is bonded to the ceramics base (1) on at least one side thereof through a brazing filler metal layer including Ag, Cu and Ti. The brazing-filler-metal-extruding part (4a) is formed by a part of the brazing filler metal layer extruding outwardly from the side face of the copper circuit board (5). In the brazing-filler-metal-extruding part (4a), Ti and TiN phases account for 3 mass% or larger in total which is different from the total quantity of Ti and TiN phases in the brazing filler metal layer 4b interposed between the ceramics base and the copper circuit board. The brazing-filler-metal-extruding part (4a) includes no more than one cavity (including no cavity) whose area is 200 μmor less per cavity. |
