发明名称 |
Light Emitting Device |
摘要 |
A provided light includes a semiconductor chip including a p-type semiconductor layer and an n-type semiconductor layer, the semiconductor chip being adapted to emit light between the p-type semiconductor layer and the n-type semiconductor layer; a p-side pad electrode disposed on an upper surface side of the semiconductor chip and over the p-type semiconductor layer; an n-side pad electrode disposed on an upper surface side of the semiconductor chip and over the n-type semiconductor layer; a resin layer disposed to cover the upper surface of the semiconductor chip; a p-side connection electrode and an n-side connection electrode disposed at an outer surface of the resin layer and positioned on the upper surface side of the semiconductor chip; and a metal wire disposed in the resin. The metal wire is adapted to make connection at least one of between the p-side pad electrode and the p-side connection electrode, and between the n-side pad electrode and the n-side connection electrode. |
申请公布号 |
EP2797131(A1) |
申请公布日期 |
2014.10.29 |
申请号 |
EP20140165717 |
申请日期 |
2014.04.24 |
申请人 |
NICHIA CORPORATION |
发明人 |
YONEDA, AKINORI;KINOUCHI, AKIYOSHI;KASAI, HISASHI;AIHARA, YOSHIYUKI;SASA, HIROKAZU;NAKAMURA, SHINJI |
分类号 |
H01L33/62;H01L33/48;H01L33/54 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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