SEMICONDUCTOR PACKAGE HAVING TSV AND ADHESIVE LAYER

摘要

A first semiconductor chip having through-silicon vias (TSVs) is mounted on a substrate. A second semiconductor chip having an active layer is mounted on the first semiconductor chip. A bonding layer is formed between the first semiconductor chip and the active layer. Connection terminals penetrate the bonding layer to be connected to the TSVs and the active layer. The sides of the bonding layer are arranged in the sides of the second semiconductor chip.