| 摘要 |
PROBLEM TO BE SOLVED: To reduce temperature variation while conveying a printed circuit board, a semiconductor wafer, and the like, and heat or cool the printed circuit board and the like more uniformly.SOLUTION: In an upper and lower region on one side with a center portion orthogonal to a conveying direction in a nozzle arranging region of a nozzle cover 3 as a reference, a second nozzle pattern is provided linear-symmetrical to a first nozzle pattern. In an upper and lower region on the other side, the first nozzle pattern is provided linear-symmetrical to the second nozzle pattern, so that arranging patterns diagonally aligned in the nozzle arranging region become identical to each other. Suction ports 3b, 3c, 3d having predetermined opening width for circulating gas blown from a blowing nozzle 2 are arranged between two or more blowing nozzles 2, and across a first column and plural other columns with different phases. Width of the suction ports 3b, 3c, 3d are set gradually narrower with the center portion as a reference. |
