CARRIER-FITTED COPPER FOIL

摘要

PROBLEM TO BE SOLVED: To provide a carrier-fitted copper foil suitable for fine pitch formation.SOLUTION: The provided carrier-fitted copper foil is a carrier-fitted copper foil including: a copper foil carrier; a release layer laminated atop the copper foil carrier; and an ultrathin copper layer laminated atop the release layer wherein the average Rz value of the ultrathin copper layer surface as measured with a contact-type roughness meter in compliance with JIS B 0601-1994 is 1.5μm or below and wherein the standard deviation of Rz is 0.1μm or below.