| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing an aluminum etched plate capable of properly proceeding AC etching by a depth of 50μm or more even when aluminum is dissolved in an etchant.SOLUTION: In an etching process forming an etching part having a depth 50μm or more per single side by applying AC current to an aluminum plate in an etchant, the amount of aluminum in the etchant c (g/litter) and a peak current density of the AC current i (mA/cm) is set to satisfy all of following conditions, i≤- 12.5×c+412.55 g/litter≤c≤13 g/litter.</p> |
