APPARATUS AND METHODS FOR REDUCING IMPACT OF HIGH RF LOSS PLATING

摘要

To reduce the radio frequency (RF) losses associated with high RF loss plating, such as, for example, Nickel/Palladium/Gold (Ni/Pd/Au) plating, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) is placed in an RF upper signal path with respect to the RF signal output of the RFIC. By placing the on-die passive device in the RF upper signal path, the RF current does not directly pass through the high RF loss plating material of the passive device bonding pad.

主权项

1. An electronic circuit module configured to reduce signal losses, the module comprising:
an electronic circuit device including a first lead, a second lead, and an integrated circuit die having an on-die passive component, the electronic circuit device configured to have an output signal and current associated with the output signal when the electronic circuit device is activated; and a trace configured to conduct the current from the output signal to an output of the electronic circuit module, the trace having a first bonding pad electrically connected to the first lead and a second bonding pad located on the trace between the first bonding pad and the output of the electronic circuit module and electrically connected to the second lead, the electronic circuit device configured such that the on-die passive component electrically connects to the first lead and the output signal electrically connects to the second lead, the current thereby being directed away from the first bonding pad.