| 发明名称 |
CONDUCTIVE PATTERN, METHOD FOR FORMING THE SAME, PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF THE SAME |
| 摘要 |
A forming method of a conductive pattern including a base material and a pattern of a composition gradient layer in which the composition continuously changes from a metal to a resin in a thickness direction from the farthest side to the base material toward the nearest side to the base material, includes: ejecting at least two kinds of ink compositions of an ink composition containing a metal and an ink composition containing a compound capable of being cured with active energy ray, or a polymer or oligomer, onto the base material by an inkjet method to fabricate the composition gradient layer. |
| 申请公布号 |
US2014161971(A1) |
申请公布日期 |
2014.06.12 |
| 申请号 |
US201414183379 |
申请日期 |
2014.02.18 |
| 申请人 |
FUJIFILM CORPORATION |
发明人 |
KASAI Seishi |
| 分类号 |
C09D11/00 |
主分类号 |
C09D11/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A forming method of a conductive pattern comprising a base material and a pattern of a composition gradient layer in which the composition continuously changes from a metal to a resin in a thickness direction from the farthest side to the base material toward the nearest side to the base material, which comprises
ejecting at least two kinds of ink compositions of an ink composition containing a metal and an ink composition containing a compound capable of being cured with active energy ray, or a polymer or oligomer, onto the base material by an inkjet method to fabricate the composition gradient layer.
|
| 地址 |
Tokyo JP |
