| 摘要 |
Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide (414) with a central rib (610) and with a high thermal resistance to the surrounding external environment and a low thermal resistance to a localized heater. In particular, the thermal resistances associated with thermal dissipation paths from a heater in the optical device to an external environment via electrodes (612-2, 612-1) and vias connecting the semcionductor material of the optil waveguide and via the substrate are increased, while the thermal resistance between the optical waveguide and the heater is decreased. The heat flowm from the electrodes into the surroundings of the optical waveguide is reduced by implementing high doped regions (614-1, 614-2) and low doped regions (616-1, 616-2) in the surrounding clad for improving electrical and thus also thermal contact between electrodes and waveguide. |
