| 发明名称 |
UNDERFILL COMPOSITION |
| 摘要 |
<p>The present invention provides a composition which does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to an underfill sealant composition comprising (a) a (meth)acrylic compound and (c) an isocyanuric acid having an allyl group.</p> |
| 申请公布号 |
KR20140068929(A) |
申请公布日期 |
2014.06.09 |
| 申请号 |
KR20147005978 |
申请日期 |
2012.09.07 |
| 申请人 |
HENKEL AG & CO. KGAA |
发明人 |
HORIGUCHI YUSUKE;SANO MIEKO;SATO KENICHIRO |
| 分类号 |
C08F220/10;C08F220/18;C08F222/00;C08F222/40;C08F226/06;C08K5/16;H01L21/60;H01L23/29;H01L23/31 |
主分类号 |
C08F220/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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