Described are techniques related to semiconductor devices that make use of encapsulant. In one implementation, a semiconductor device may be manufactured to include at least an encapsulant that includes at least glass particles.
申请公布号
US2014117531(A1)
申请公布日期
2014.05.01
申请号
US201213664418
申请日期
2012.10.31
申请人
INFINEON TECHNOLOGIES AG
发明人
MAHLER JOACHIM;FUERGUT EDWARD;HOSSEINI KHALIL;MEYER-BERG GEORG