| 摘要 |
<p>The device has a support plate to accommodate semiconductor components (10). The plate has projections at which the components are positioned such that the projections are in contact with the components. The plate accommodates positioning grids, which slide relative to each other and cooperate with each other to define housings for accommodating the components to be characterized. A measuring head is equipped with mechanical retention probes (18), which press against an inactive zone of the components in order to assure maintenance of the components on the plate.</p> |
