SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK

摘要

With respect to this substrate (1) for a power module with a heat sink, one of a metal layer (13) and a heat sink (31) is configured from aluminum or an aluminum alloy, and the other is configured from copper or a copper alloy. The metal layer (13) and the heat sink (31) are joined together by solid-phase diffusion bonding; an intermetallic compound layer that is formed of Cu and Al is formed at the bonding interface between the metal layer (13) and the heat sink (31); and oxides are dispersed in the form of a layer along the interface between the intermetallic compound layer and the metal layer (13) or the heat sink (31), which is formed of copper or a copper alloy.