发明名称 INSULATIVE MATERIAL FOR SEMICONDUCTOR USE INCLUDING SILICA PARTICLES
摘要 PROBLEM TO BE SOLVED: To provide an insulative material for semiconductor use including silica particles which can reduce a leak current.SOLUTION: An insulative material for semiconductor use comprises silicon atoms, carbon atoms, and oxygen atoms. The insulative material includes silica particles by 9.5 to 30 vol.%, exclusive of 9.5. The composition ratio (C/Si) of the carbon atoms to the silicon atoms is between 0 and 0.85, exclusive of 0. In grazing-incidence X-ray small angle scattering (GI-SAXS) measurement, the ratio (I(q)/I(q)) of a scattering intensity I(q) when the scattering vector q is 0.1 nmto a scattering intensity I(q) when the scattering vector q is 0.2 nmis 1.35 or less.
申请公布号 JP2014067829(A) 申请公布日期 2014.04.17
申请号 JP20120211345 申请日期 2012.09.25
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 NANBO MASAKAZU;TAKADA SHOZO
分类号 H01L21/312;H01L21/316 主分类号 H01L21/312
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