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发明名称
真空环境中加热基板的方法及系统
摘要
申请公布号
TWI433196
申请公布日期
2014.04.01
申请号
TW098141869
申请日期
2009.12.08
申请人
汉民微测科技股份有限公司 新竹市新竹科学工业园区研新一路18号4楼
发明人
萧宏;王义向
分类号
H01J37/28;H01L21/66
主分类号
H01J37/28
代理机构
代理人
蔡朝安 新竹市科学工业园区力行一路1号E之1;郑淑芬 新竹市科学工业园区力行一路1号E之1
主权项
地址
新竹市新竹科学工业园区研新一路18号4楼
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