发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To suppress the occurence of refrigerant leaks in a semiconductor module including a cast plate with a cooling fin. <P>SOLUTION: A plate part 17a of a plate having a cooling fin 17 includes a metal plate 17c, and the metal plate 17c functions as a stopper. In this structure, even if a surface layer, called mill scale, on the back side of the cooling fin 17b or the plate part 17a corrodes and refrigerant such as coolant penetrates into the inner side of the surface layer, the metal plate 17c prevents the refrigerant from penetrating further. Consequently, even if the plate having the cooling fin 17 is formed by a method, such as casting, which tends to leave bubbles called pin holes and the refrigerant penetrates into an area in which strings of the pin holes are formed, a passage penetrating from the surface to the back side of the plate part 17a is not formed. Therefore, the occurence of the refrigerant leaks is prevented. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5353825(B2) 申请公布日期 2013.11.27
申请号 JP20100132170 申请日期 2010.06.09
申请人 发明人
分类号 H01L23/36;H01L25/07;H01L25/18 主分类号 H01L23/36
代理机构 代理人
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