发明名称 |
Integrated circuit and method of manufacturing the same |
摘要 |
<p>Presented is an integrated circuit packaged at the wafer level wafer (also referred to as a wafer level chip scale package, WLCSP), and a method of manufacturing the same. The WLCSP comprises a die having an electrically conductive redistribution layer, RDL, formed above the upper surface of the die, the RDL defining a signal routing circuit. The method comprises the steps of: depositing the electrically conductive RDL so as to form an electrically conductive ring surrounding the signal routing circuit; and coating the side and lower surfaces of the die with an electrically conductive shielding material.</p> |
申请公布号 |
EP2648218(A1) |
申请公布日期 |
2013.10.09 |
申请号 |
EP20120163407 |
申请日期 |
2012.04.05 |
申请人 |
NXP B.V. |
发明人 |
GEMERT, LEONARDUS;BEELEN-HENDRIKX, CAROLINE;KAMPHUIS, TONNY |
分类号 |
H01L23/525;H01L21/48;H01L21/683;H01L23/00;H01L23/31;H01L23/544;H01L23/552;H01L23/60 |
主分类号 |
H01L23/525 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|