发明名称 FINE LINE METALLIZATION OF PHOTOVOLTAIC DEVICES BY PARTIAL LIFT-OFF OF OPTICAL COATINGS
摘要 A metal grid contact and dielectric pattern on a layer requiring conductive contact in a photovoltaic device. The invention includes, in one aspect, forming a metal film; forming an etch resist over the metal film by, e.g., directly writing and in-situ curing the etch resist using, e.g., ink-jetting or screen-printing; etching the metal film leaving the resist pattern and a metal grid contact pattern under the etch resist intact; forming a dielectric layer over the etch resist; and removing the resist pattern and the dielectric over the etch resist, leaving a substantially co-planar metal grid contact and dielectric pattern. The metal grid contact pattern may form the front and/or back contact electrode of a solar cell; and the dielectric layer may be an optical reflection or antireflection layer. The layer requiring contact may be multifunctional providing its own passivation, such that passivation is substantially not required in the dielectric layer.
申请公布号 KR20130108496(A) 申请公布日期 2013.10.04
申请号 KR20127008955 申请日期 2011.02.15
申请人 TETRASUN, INC. 发明人 SCHULTZWITTMANN OLIVER;CRAFTS DOUGLAS;DECEUSTER DENIS;TURNER ADRIAN
分类号 H01L31/042;H01L31/18 主分类号 H01L31/042
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