发明名称 |
Manufacturing method of lead frame substrate and semiconductor apparatus |
摘要 |
A lead frame substrate, including: a metal plate with a first surface and a second surface; a connection post formed on the first surface; wiring formed on the second surface; and a pre-molding resin layer, in which a thickness of the pre-molding resin layer is the same as a height of the connection post.
|
申请公布号 |
US8546940(B2) |
申请公布日期 |
2013.10.01 |
申请号 |
US20090998099 |
申请日期 |
2009.09.29 |
申请人 |
MANIWA SUSUMU;TSUKAMOTO TAKEHITO;TODA JUNKO;TOPPAN PRINTING CO., LTD. |
发明人 |
MANIWA SUSUMU;TSUKAMOTO TAKEHITO;TODA JUNKO |
分类号 |
H01L23/52;H01L23/48;H01L29/40 |
主分类号 |
H01L23/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|