METHOD OF INCREASING HEAT DISSIPATION AND RADIATION PROTECTION OF ELECTRONIC COMPONENTS

摘要

FIELD: radio engineering, communication.SUBSTANCE: amorphous element placed in an elastic packet is placed between two printed-circuit boards; a double-sided compression force is applied onto the printed-circuit boards, enabling to form a "mirror" surface relief of the amorphous element, and then held for a given time until it hardens, wherein the amorphous element is obtained by mixing a hardener with metal-containing filler in ratio of 1:(1-3).EFFECT: improving radiation protection of electronic components, protection thereof from electrostatic discharges and electromagnetic interference and improving heat dissipation of the components.4 dwg