ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

摘要

Provided is an electronic component capable of establishing a highly reliable connection with a via hole conductor penetrating a resin layer formed so as to cover a wiring board and a conductor pattern formed on the wiring board. The electronic component (10) includes the wiring board (12). A recess (18), included in a stress relief structure, is formed on a conductor pattern (16a) for the via hole conductor, on one principal surface side of the wiring board (12). An electronic component element (20) is surface-mounted on the one principal surface side of the wiring board (12). The electronic component element (20) and the one principal surface of the wiring board (12) are covered by a resin layer (24). A via hole conductor (28) is formed in the resin layer (24) so as to penetrate the resin layer (24). The via hole conductor (28) is connected to the conductor pattern (16a). A connecting portion (30) between the via hole conductor (28) and the conductor pattern (16a) for the via hole conductor are formed in the recess (18) on the wiring board (12).