| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable optical sensor device which improves the peeling strength of wiring patterns provided by metalization, reduces the performance deterioration caused as devices are mounted, and increases the stability of electric conduction, which achieves low cost and a small size. <P>SOLUTION: An optical sensor element is mounted in a package composed of a glass lid substrate 1 having a filter function and a glass substrate 2 having a cavity. The glass substrate 2 having the cavity has through electrodes 5 where a metal is buried and wiring patterns 6, 7 respectively provided on a front surface and a rear surface and formed by metalization and is fastened to wiring patterns 4, provided at the glass lid substrate 1 by metalization, by an adhesive containing conductive particles 8 to be connected therewith. The wiring patterns 6, 7 respectively provided on the front surface and the rear surface of the substrate 2 having the cavity and formed by the metalization and the metal buried in the through electrodes are structurally and electrically integrated. <P>COPYRIGHT: (C)2013,JPO&INPIT |
