| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film forming apparatus that can improve the pressure in a processing space. <P>SOLUTION: A putting table 3 that includes a putting region of a wafer W that is a substrate, and a top board part material 4 opposed to the putting table 3 are installed in a processing vessel 2; the putting table 3 is raised to the side of the top board part material 4 by a lifting mechanism 5; and a processing space S is formed between the putting table 3 and the top board part material 4. A projection part 43 is disposed at least at one of the outer region of the putting region of the putting table 3 and the top board part material 4, and the tip of the same comes in contact with the other when the processing space S is formed. Thus the clearance between the outer region and the top board part material 4 is restricted, and a gap 40 for exhaust of less than 1 mm is formed to enclose the putting region. Because the gap 40 is narrow, the reaction gas can be enclosed in the processing space S, and the pressure in the processing space is raised. <P>COPYRIGHT: (C)2013,JPO&INPIT |
