| 摘要 |
PURPOSE: A light emitting device package and a manufacturing method thereof are provided to prevent the cohesion of a plating layer due to heat generated from a light emitting device by annealing the plating layer in a process of manufacturing a lead frame. CONSTITUTION: A lead frame is supported by a package body. A light emitting device is positioned within a cavity. The lead frame includes a first metal layer(220) and an cohesion layer(230). The cohesion layer is formed on the first metal layer exposed on the lower part of the cavity. The reflectivity of the cohesion layer is higher than the reflectivity of the first metal layer.
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