| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing device and a manufacturing method of a multilayer wiring board capable of efficiently and accurately manufacturing a multilayer wiring board. SOLUTION: This manufacturing device 1 has a tentative welding part 12 executing tentative welding for a layered product comprising a predetermined number of stacked wiring boards A and prepregs B, and a hole boring part 14 applying boring and regular welding to the layered product. In the tentative welding part 12 out of them, further welding for a layered product formed by adding a new wiring board to the layered product with the tentative welding once completed can be executed. Such a process can be basically repeated any number of times. During the repeated process, the boring in the hole boring part 14 is simultaneously executed. COPYRIGHT: (C)2009,JPO&INPIT |
