| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package structure which has a relatively small thickness and protects adjacent solder balls from short circuits due to a reflow process, and to provide a manufacturing method of the package structure. <P>SOLUTION: A patterning insulation layer 130 is formed on a first seed layer to expose a part of the first seed layer. A patterning circuit layer 140 is formed on an exposed portion of the first seed layer to cover a part of the patterning insulation layer 130. A chip bonding process is performed so that a chip electrically connects with the patterning circuit layer 140. A sealant 170, sealing the chip and the patterning circuit layer 140 and covering the patterning insulation layer 130, is formed. The metal substrate and the first seed layer are removed so as to expose a bottom surface 132 of the patterning insulation layer 130 and a lower surface 142 of the patterning circuit layer 140. Solder balls 180 are formed on the lower surface 142 of the patterning circuit layer 140. <P>COPYRIGHT: (C)2013,JPO&INPIT |
