发明名称 COMPONENT MOUNTING APPARATUS AND METHOD FOR PHOTOGRAPHING COMPONENT
摘要 There is provided a component mounting apparatus, which includes: a nozzle which sucks a component; a nozzle supporting member, on which the nozzle is installed, which moves in a vertical direction with respect to an upper surface of a substrate on which the component sucked at the nozzle is mounted; an optical system which captures an image of a leading edge portion of the nozzle where the component is sucked in a component mounting operation, from a side direction, such that an optical axis of the optical system is inclined at a predetermined angle with respect to a sucking surface of the nozzle; and an analyzer which analyzes the image of the leading edge portion to determine whether a sucking state of the component sucked by the nozzle is normal or abnormal.
申请公布号 US2012304459(A1) 申请公布日期 2012.12.06
申请号 US201213483520 申请日期 2012.05.30
申请人 TAKAYUKI HATASE;SAMSUNG TECHWIN CO., LTD. 发明人 TAKAYUKI HATASE
分类号 H05K3/30 主分类号 H05K3/30
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