| 摘要 |
A light emitting device package (100) is disclosed. The light emitting device package (100) includes a light emitting device (130) disposed on a first lead frame (121), the light emitting device (130) having an electrode pad (150) on an upper surface thereof, a first wire (170) to electrically interconnect a second lead frame (122) spaced apart from the first lead frame (121) and the electrode pad (150), and a first bonding ball (190) disposed on the second lead frame (122), the first bonding ball (190) spaced apart from a first contact point (180), which is in contact with the first wire (170) and the second lead frame (122), wherein the first bonding ball (190) is disposed between the first wire (170) and the second lead frame (122) to electrically interconnect the first wire (170) and the second lead frame (122). In the light emitting device package (100), the wire (170) is fixed using the bonding ball (190) upon wire bonding, thereby preventing the wire (170) from separating from the lead frame (122) at the bonded portion therebetween. Also, the wire (170) is electrically connected to the lead frame (122) via the bonding ball (190), thereby improving reliability of wire bonding. |
