发明名称 |
ADHESIVE COMPOSITION FOR A WAFER PROCESSING FILM |
摘要 |
The present invention relates to an adhesive composition for a wafer processing film, a wafer processing film, and a semiconductor wafer processing method. In the semiconductor wafer processing process such as a dicing process or a back grinding process, a delaminating force with respect to a wafer to be attached may be effectively reduced to improve process efficiency and prevent the wafer from being warped or cracked. |
申请公布号 |
WO2012121547(A3) |
申请公布日期 |
2012.11.15 |
申请号 |
WO2012KR01672 |
申请日期 |
2012.03.07 |
申请人 |
LG HAUSYS, LTD.;KIM, JANGSOON |
发明人 |
KIM, JANGSOON |
分类号 |
C09J133/04;C09J7/02;H01L21/304 |
主分类号 |
C09J133/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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