THERMOSETTING RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME, AND PREPREG AND LAMINATED PLATE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can reduce the coefficient of thermal expansion while suppressing an increase in volume fraction of an inorganic filler; a method for producing the same; and a prepreg using the thermosetting resin composition; and a laminated plate using the prepreg.

SOLUTION: This thermosetting resin composition contains a thermosetting resin (A) and an inorganic porous material (B), where a part of the thermosetting resin (A) is impregnated in pores of the porous material (B); and the ratio (eB/eA) of the elastic modulus (eB) of the porous material (B) at 25°C to the elastic modulus (eA) of the cured product of the thermosetting resin (A) at 25°C is 5-100. The prepreg and the laminated plate using this are also provided.

COPYRIGHT: (C)2012,JPO&INPIT