| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing apparatus in which the selection ratio of selective etching can be enhanced. <P>SOLUTION: A substrate W is silylated when a silylation reagent is supplied thereto. When an etching agent is supplied subsequently to the substrate W, the substrate W thus silylated is etched. <P>COPYRIGHT: (C)2012,JPO&INPIT |
