发明名称 |
Multi-layer printed wiring board |
摘要 |
A multi-layer printed circuit board for mounting memories, includes: laminated wiring layers on which wiring is arranged; and a plurality of interlayer connection components which electrically connect at least two of the wiring layers. At least one of the plurality of interlayer connection components is a blind via-hole. |
申请公布号 |
US8198549(B2) |
申请公布日期 |
2012.06.12 |
申请号 |
US20070004020 |
申请日期 |
2007.12.20 |
申请人 |
SAITO SHUNICHI;SUGANO TOSHIO;HIRAISHI ATSUSHI;ELPIDA MEMORY, INC. |
发明人 |
SAITO SHUNICHI;SUGANO TOSHIO;HIRAISHI ATSUSHI |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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