发明名称 Multi-layer printed wiring board
摘要 A multi-layer printed circuit board for mounting memories, includes: laminated wiring layers on which wiring is arranged; and a plurality of interlayer connection components which electrically connect at least two of the wiring layers. At least one of the plurality of interlayer connection components is a blind via-hole.
申请公布号 US8198549(B2) 申请公布日期 2012.06.12
申请号 US20070004020 申请日期 2007.12.20
申请人 SAITO SHUNICHI;SUGANO TOSHIO;HIRAISHI ATSUSHI;ELPIDA MEMORY, INC. 发明人 SAITO SHUNICHI;SUGANO TOSHIO;HIRAISHI ATSUSHI
分类号 H05K1/11 主分类号 H05K1/11
代理机构 代理人
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