摘要 |
Method for stacking microelectronic devices using two or more carriers, each holding microelectronic devices in an array so they may be registered. Each device is releasably held by its edges in a carrier to allow access to top and bottom surfaces of the device for joining. Arrays of devices held in two or more carriers are juxtaposed and joined to form an array of stacked devices. A resulting stacked device is released from the juxtaposed carriers holding each device by releasing forces of the corresponding carrier urging upon edges of the device, thereby permitting removal of the stacked device.
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