CERAMIC HEAT SINK MATERIAL FOR COMPRESSION CONTACT STRUCTURE, SEMICONDUCTOR MODULE USING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE

摘要

This ceramic heat sink for a compression contact structure, which provides a resin layer on a ceramic substrate, is characterized by the durometer (Shore) hardness (A) of the resin layer being 70 or less and the space present in the interface of the ceramic substrate and resin layer having an average value of 3 µm or less. In addition, the resin layer is preferably formed from a solidified thermosetting resin that exhibits fluidity at 60°C. According to this constitution, a ceramic heat sink with good adhesion with a retaining member and a semiconductor module using the same can be obtained.