| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sintering process for stably coupling an electronic component to a substrate at a process temperature of less than 250°C. <P>SOLUTION: A process for fixing an electronic component to a substrate includes (i) a step for preparing the electronic component and the substrate, (ii) a step for creating a sandwich component having the electronic component, the substrate, and a layer arranged between them and containing paste containing (a) a metallic particle having a coating containing at least one compound selected from a group of a fatty acid, a fatty acid salt and fatty acid ester, and (b) at least one aliphatic hydrocarbon compound, and (iii) a step for sintering the sandwich component. <P>COPYRIGHT: (C)2012,JPO&INPIT |
