SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR PRODUCING SAME, AND DISPLAY DEVICE

摘要

A semiconductor light-emitting device (101) includes: an LED chip (4); a lead (1) having a principal surface (11) on which the LED chip (4) is mounted; and a resin package (5) that covers the LED chip (4). The principal surface (11) is made coarse, and the principal surface (11) and the resin package (5) are in contact with one another. With this construction, the semiconductor light-emitting device (101) can be reduced in size.