Semiconductor device and method for making the same

摘要

A semiconductor device includes a resin housing (14, 14A, 14B, 14C)provided with a functional part, a wire pattern (12a) made of a conductive material and molded in the resin housing (14, 14A, 14B, 14C), a part of the wire pattern (12a) being exposed from the resin housing (14, 14A, 14B, 14C), an electronic part (9) connected with the wire pattern (12a) in a state where the electronic part (9) is molded in the resin housing (14, 14A, 14B, 14C), and a semiconductor element (10, 10A) connected to the part of the wire pattern (12a) exposed from the resin housing (14, 14A, 14B, 14C).