| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mask for an array capable of mounting solder balls with good precision even to a chip package with narrowed intervals of electrodes. <P>SOLUTION: A mask for an array mounts solder balls 2 at predetermined positions on a work 3 by depositing the solder balls 2 in through-holes 12 corresponding to a predetermined array pattern. A lower surface of a mask body 10 includes a protrusion 15, and a diameter of the protrusion 15 is formed such that it is enlarged toward the lower surface of the mask body 10. Thereby, a tip of the protrusion 15 can correspondingly abut between electrodes 6 with fine pitches, while firmly securing strength at a root of the protrusion 15, so the solder balls 6 can be reliably mounted at the predetermined positions. <P>COPYRIGHT: (C)2012,JPO&INPIT |
