| 发明名称 |
VERFAHREN ZUR PLASMAVERSTÄRKTEN VERBINDUNG UND DURCH PLASMAVERSTÄRKTE VERBINDUNG ERZEUGTE VERBUNDSTRUKTUREN |
| 摘要 |
An electronic device comprises a substrate (110) comprising a first surface and a second surface, a substrate carrier (105) comprising a first surface and a second surface, and an inorganic material (120) bonding the second surface of the substrate (110) and the second surface of the substrate carrier (105). |
| 申请公布号 |
AT536263(T) |
申请公布日期 |
2011.12.15 |
| 申请号 |
AT20050809060T |
申请日期 |
2005.10.04 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
CHEN, CHIEN-HUA;SNYDER, BARRY C.;HELLEKSON, RONALD A. |
| 分类号 |
B41J2/16;H01L21/20;H01L21/58 |
主分类号 |
B41J2/16 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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