发明名称 |
Thermal interface with non-tacky surface |
摘要 |
A thermal interface member includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns. |
申请公布号 |
US8076773(B2) |
申请公布日期 |
2011.12.13 |
申请号 |
US20070964219 |
申请日期 |
2007.12.26 |
申请人 |
JEWRAM RADESH;MISRA SANJAY;THE BERGQUIST COMPANY |
发明人 |
JEWRAM RADESH;MISRA SANJAY |
分类号 |
H01L23/34;F28F13/00;H05K7/20 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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