HIGH ADHESIVENESS SILICONE RESIN COMPOSITION, AND OPTICAL SEMICONDUCTOR DEVICE USING THE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a silicone resin composition encapsulating an optical semiconductor element which has strong adhesiveness to a substrate, and provide an optical semiconductor element with high reliability.

SOLUTION: The silicone resin composition includes 49-95 pts.mass of an organopolysiloxane (A) having at least two alkenyl groups per molecule; 0.001-50 pts.mass in total of a liner organohydrogenpolysiloxane (B-1) whose both terminals are blocked with hydrogen atoms each bonded to a silicon atom and a liner organohydrogenpolysiloxane (B-2) whose one terminal is blocked with a hydrogen atom bonded to a silicon atom and whose other terminal is blocked with a hydroxyl or alkoxy group bonded to a silicon atom, the mass ratio of (B-1) to (B-2) being 90-99.9:10-0.1; 0.01-20 pts.mass of a branched organohydrogenpolysiloxane (C) having at least three hydrosilyl groups per molecule; an additive reaction catalytic (D); and 0.001-1 pts.mass of a condensation catalyst (E).

COPYRIGHT: (C)2012,JPO&INPIT