发明名称 SUBSTRATE TREATING APPARATUS
摘要 PURPOSE: A substrate processing apparatus is provided to prevent a chemical solution from being stagnant in the surface of a spin head by discharging the chemical solution, which is sprayed from a back nozzle to in the rear side of the substrate, to the outside along a downward sloped surface. CONSTITUTION: A substrate support part comprises a spin head, a supporting member(120), and s back nozzle(130). A supporting member supports the substrate by being extended from the surface to the top. The surface includes an inclined plane which is sloped from the center to the edge side. The inclined plane is integrally formed with the spin head. Chucking pins are extended from the inclined plane and are contacted with the side of the substrate which is settled in the spin head. Support pins are extended from the inclined plane and support the end part of the substrate. The back nozzle sprays the solution on the rear side of the substrate.
申请公布号 KR20110127580(A) 申请公布日期 2011.11.25
申请号 KR20100047165 申请日期 2010.05.19
申请人 LEE, BYUNG WOOK 发明人 LEE, BYUNG WOOK
分类号 H01L21/302;H01L21/683 主分类号 H01L21/302
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