| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing a power semiconductor device, which provides the resin-sealed semiconductor device excellent in thermal shock resistance. <P>SOLUTION: The resin composition is obtained by blending a polyfunctional epoxy compound, a curing agent, an inorganic filler, and an aromatic polysulfone resin, and used as a resin composition for sealing a power semiconductor device. The aromatic polysulfone resin preferably used contains ≥6×10<SP POS="POST">-5</SP>hydroxyl groups and/or its salts per 1 g of the aromatic polysulfone resin, and has a reduced viscosity of 0.35 to 0.60 dl/g. <P>COPYRIGHT: (C)2012,JPO&INPIT |
