| 摘要 |
<P>PROBLEM TO BE SOLVED: To identify a record of each printed circuit board by an identification mark in the manufacturing process of a raw material of a substrate. <P>SOLUTION: A method for manufacturing a printed circuit board comprises: (a) an identification mark disposing step of defining a substrate surface 11 of a substrate 1 as a processing surface and disposing an identification mark 2 on the processing surface; (b) a lamination step of forming a transparent area 31 in a circuit layer 3, laminating a transparent insulation layer 4 and the circuit layer 3 on the processing surface according to an order, and allowing the transparent area 31 to correspond to the identification mark 2; and (c) a thermocompression step of subjecting the substrate 1, the transparent insulation layer 4 and the circuit layer 3 to thermocompression at a temperature of 150°C or higher and at a pressure of 280 psi (about 1.93 MPa) or more to collectively form a printed circuit board. <P>COPYRIGHT: (C)2012,JPO&INPIT |
