| 发明名称 |
Metal plating compositions |
| 摘要 |
Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
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| 申请公布号 |
US8048284(B2) |
申请公布日期 |
2011.11.01 |
| 申请号 |
US20080080484 |
申请日期 |
2008.04.02 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
REDDINGTON ERIK;DESMAISON GONZALO URRUTIA;NIAZIMBETOVA ZUKHRA I.;CLEARY DONALD E.;LEFEBVRE MARK |
| 分类号 |
C25D3/56;C23C16/40;C23C18/36;C23C18/40;C23C18/44;C25D3/00;C25D3/46;C25D3/48;C25D3/50;C25D3/58;C25D3/60;C25D3/62 |
主分类号 |
C25D3/56 |
| 代理机构 |
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