| 发明名称 |
METHOD FOR MANUFACTURING LED PACKAGE AND SUBSTRATE THEREOF |
| 摘要 |
In a method for manufacturing a LED package, a substrate of the LED package is formed by thermally pressing at least one insulating plate over an electrode plate and then grinding the insulating plates to expose the electrode plate.
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| 申请公布号 |
US2011256646(A1) |
申请公布日期 |
2011.10.20 |
| 申请号 |
US20100941077 |
申请日期 |
2010.11.07 |
| 申请人 |
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
LIN SHEN-BO |
| 分类号 |
H01L33/48 |
主分类号 |
H01L33/48 |
| 代理机构 |
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| 主权项 |
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